The Future of ALD
ATLANT 3D’s DALP® technology introduces a groundbreaking form of additive manufacturing at the atomic scale, enabling precise, localized deposition of multiple materials without masks—offering unmatched flexibility, resolution, and design freedom.
This talk presents ATLANT 3D’s revolutionary Direct Atomic Layer Processing (DALP®) technology—an advanced atomic-scale additive manufacturing platform that disrupts conventional microfabrication by enabling localized, maskless, and multimaterial deposition directly onto substrates. DALP® introduces a new class of multimodal processing, combining additive, subtractive, and surface modification capabilities into a single, digitally controlled system.
Through direct atomic layer deposition, etching, doping, cleaning, and molecular layer printing, DALP® transforms how we design and manufacture microscale devices. It allows for the creation of complex 3D structures, rapid prototyping, and high-throughput experimentation—all with unmatched precision and sustainability. Attendees will gain insights into the enabling power of this technology for applications across optics, semiconductors, energy, and beyond, and see how DALP® accelerates the journey from concept to device, atom by atom.
Presentation language: EN
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